Products And Services

ROBOTIC HOT SOLDER DIP

• Automated micro-robotic hot solder dip with precise control of all parameters.
• RoHS ↔ SnPb finish conversion per GEIA-STD-0006.
• Removes oxidation and gold to restore solderability.

BGA REBALLING

• Converts BGAs between SnPb and Pb-free alloys per GEIA-STD-0006 & J-STD-001.
• No tooling/NRE required for new BGA types.
• Inspection with X-ray, AOI, and coplanarity scan ensures reliability.

PRECISION LEAD FORMING

• Custom lead trimming/forming for through-hole and SMT components.
• Automated equipment for volume + manual setups for unique parts.
• Supports axial, radial, DIP, quad-pack, and connector leads.
• Ensures geometry, co-planarity, and stress-free forming.

TAPE & REEL PACKAGING

• EIA-481 compliant tape-and-reel packaging.
• Automated and manual equipment for any volume.
• Custom carrier tape solutions available for odd-shaped parts.
• Performed in ESD-safe environment with barcoding/traceability.

BAKE & DRY PACK SERVICES

• JEDEC J-STD-033 compliant baking and dry pack for moisture-sensitive devices.
• Vacuum-sealed with desiccant and humidity cards.
• Prevents reflow failures and extends shelf life.

GROSS & FINE LEAK TESTING

• MIL-STD-883 compliant hermeticity testing via certified lab partners.
• Fine leak helium mass spectrometry and gross leak immersion testing.
• Validates seal integrity for aerospace and defense components.

XRF MATERIAL ANALYSIS

• Non-destructive elemental analysis for alloy verification.
• Confirms plating composition and thickness.
• Detects counterfeit or substandard finishes.

IONIC CLEANLINESS TESTING

• ROSE method measures residual ionic contamination post-processing.
• Automated aqueous wash system with continuous monitoring.
• Reports provided to ensure compliance with IPC and MIL standards.